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Technologies

Core values of PEC MEMS probes

1. Short length probes supporting high speed & frequency test

With the recent growth of AI and HPC, the need for higher data rates is increasing to enable real-time communication. To respond to these changes, wafer & package test environments are also being required to meet ＞60GHz bandwidth to ensure high DUT yield of IO devices. MEMS buckling & micro-cantilever & MEMS spring probe with short length and arbitrary probe shape can be designed to meet customer’s desire specifications.

  • Buckling probes
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  • Micro-cantilever probes
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  • MEMS spring pin
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  • Short probes have advantages in…
    Wafer test with high speed
    Wafer test with high frequency
    Fine pitch WLCSP/package test

    • Reliable wafer-scale production possible


    • Short length probes with various pitches

    - 2.5mm length buckling probes for 90um pitch

    - 1.0mm length MEMS spring for ≥150um pitch


    • Customized design & adjustable force upon customer needs

2. Low contact force probe (adjustable contact force)

In general, there is trade-off between the contact force of probe and the probe length, and the margin for the trade-off becomes smaller as the probes decrease in size. However, the MMPM technology’s multi-beam solution with micron-precision features allows decoupling of trade-off between probe length and contact force.

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  • Low force have advantages in…
    Wafer test with high parallelism
    Hybrid probing solution

    • Adjustable contact force

    through adjustment of multi-beam design


    • Allow uniform contact force in probecard

    in hybrid probing solution


    • Lower force probe with high CCC

    - 90*90um size of probe with 2.5gf, >2A CCC

3. Metal options with high stability & optimal properties

The high temperature and chemical resistance of MMPM allows optimal electroplating conditions for each metal properties. In addition, Au multi-layer is possible with MMPM MEMS technology, which is difficult to applied in an electroplating environment where photoresists are used as molds

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  • Metal options have advantages in…
    Test with high temperature
    Electrical signal reliability test

    • Au multi-layer electroplated probe

    with high temperature stability and oxidation resistance


    • Pd alloy with high durability and hardness

    as maintaining optimal electroplating condition


    • Simplify MEMS electroplating process

    via max 120um thickness electroplating at once

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