R&D

R&D Project

• Micro bump
• Inductor

• Conventional C4 Bump

  

  • Diameter: 50 ~ 200um
  • Pitch: 30 ~ 200um
  • Solder Cap shape: Oval

• PEC Micro Pillar Bump

  

  • Diameter: 10 ~ 100um
  • Pitch: 15 ~ 150um
  • Solder Cap shape: Per customer's request
  • Material: Per customer's request

  • Minimize size up to ∅10um
  • Narrow the pitch up to ∅15um
  • Freedom of shape and design
  • Fully vertical Cu Pillar

Leading the new era with
Cutting-edge semiconductor packaging solution

Micro Pillar Bump

Solder layer

Materials

① SnAg / ② Ni

Thickness

3 ~ 6um (± 1)

Pillar

Materials

① SnAg / ② Ni

Size

10 ~ 100um (± 1)

Thickness

10 ~ 100um (± 3)

Design

Array pitch

(20 ~ 150um)

---